HDPE Microduct Pipe Direct Buried Bundle 1, 2, 3, 4, 7, 12, & 24 Way
Overview
Our Direct Buried Microduct Bundles are manufactured from premium-grade HDPE, ensuring long-term durability, high tensile strength, and resistance to environmental stress cracking. These ducts are engineered to withstand extreme underground conditions, including soil movement, temperature changes, moisture ingress, and mechanical impact.
Available in multiple configurations—1, 2, 3, 4, 7, 12, and 24 Way—our microduct bundles provide flexible solutions for diverse fiber deployment needs, ranging from small rural installations to large-scale urban infrastructure.
Product Description
Microduct assemblies are available for several installation environments such as direct buried installation, into existing pipes or for indoor installation. Microducts are characterised by heavy wall microducts and a relatively thin outer sheath. The thickness of each inner tube allows individual tubes to be used direct bury solution. The microducts are rugged enough to protect the fiber cables inside. Micro ducts are made of HDPE and have a low friction inner surface for best blowing performance. Product Features
- High-Quality Material: Made from UV-stabilized, virgin HDPE material for superior environmental resistance and mechanical strength.
- Direct Burial Rated: Designed with an outer sheath for added protection, eliminating the need for additional casing or conduit.
- Multiple Configurations: Offered in 1 to 24-way configurations to accommodate future-proof network expansion and customized routing.
- Silicone-Lined Inner Wall: Each inner microduct includes a low-friction, permanent silicone lining that enhances blowing performance for fiber cables, supporting longer installation distances.
- Color-Coded Ducts: Individual microducts are color-coded or numbered for easy identification during splicing and termination.
- Seamless Integration: Compatible with industry-standard connectors, fittings, and blowing machines, ensuring a smooth installation and maintenance process.
- High Crush Resistance: Engineered to resist soil load and heavy-duty external pressures when directly buried without requiring additional encasement.
Applications
- FTTH (Fiber to the Home) Networks
- FTTx (Fiber to the x) Rollouts
- Backbone and Metro Networks
- Rural Broadband Expansion
- Smart City Infrastructure
- Data Center Interconnects
- Railway, Roadway, and Utility Projects
Whether you’re deploying fiber in urban environments, across rural terrain, or for mission-critical applications, our HDPE Direct Buried Microduct Bundles offer a scalable, reliable solution for your network infrastructure.
Specifications and Options
| Configuration | No. of Microducts | Outer Sheath Diameter | Standard Microduct Size | Color Coding |
|---|
| 1 Way | 1 | Varies | 5/3.5mm, 7/5.5mm, 10/8mm | Solid/Striped |
| 2 Way | 2 | Compact | Customizable | Yes |
| 3 Way | 3 | Round/Triangular | Yes | Yes |
| 4 Way | 4 | Rectangular/Round | Yes | Yes |
| 7 Way | 7 | Clustered | Yes | Yes |
| 12 Way | 12 | High-Density Bundle | Yes | Yes |
| 24 Way | 24 | Ultra-Dense Bundle | Yes | Yes |
Custom configurations and sizes are also available upon request, tailored to meet specific network design or geographical requirements.
Advantages
- Future-Proof Design: Enables easy addition of new fiber without re-trenching or re-pulling ducts.
- Reduced Installation Time: Bundled design simplifies deployment and trenching operations.
- Long-Term Reliability: Resistant to corrosion, rodents, and harsh underground environments.
- Cost-Effective: Consolidates multiple duct pathways into one, minimizing installation footprint and cost.
Conclusion
Our HDPE Direct Buried Microduct Pipe Bundles are the ideal choice for network operators, telecom companies, and infrastructure providers looking for scalable, high-performance, and long-lasting fiber optic ducting solutions. With configurations ranging from 1 to 24 ways and built-in features to optimize installation, performance, and longevity, these microducts are ready to meet the growing demand for high-speed data connectivity in any environment.
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